Exhibitor news

Ganter’s indexing plunger selection is extremely diverse. And yet the standard parts experts from the Black Forest continue to find new functional niches to fill: indexing plungers with chamfered pins. They are nearly universal elements that can be found anywhere that latching, locking and securing is required: indexing plungers. Despite the diverse range of types and dimensions, they previously all had one thing in common: The latching process typically makes use of a cylindrical hole that is aligned with the plunger pin, allowing the pin to engage without difficulty. For example, when a carriage travels past a latching hole. But there are also cases in which only an edge or a groove must suffice for latching, and it may not even be precisely positioned relative to the plunger pin. For such situations, Ganter has now developed a new type of indexing plunger that can independently latch into edges and grooves. This is made possible by a chamfered plunger pin. When the chamfered pin encounters a raised latching geometry, it retracts and then springs back out again once it reaches the latching point. More information on Ganter standard parts can be found on the internet at ganternorm.com

Individual enclosure solutions for which BOPLA deals with every stage of processing, from the initial idea to series production, are becoming increasingly popular. In creating intelligent products and tailor-made product solutions, the enclosure technology specialists combine their interdisciplinary expertise in the design, construction, HMI and electronics sectors to create an all-round carefree package for their customers. Industrial designer Sebastian Hein has recently started to provide his knowhow to the development team. “Enclosures are a product’s visiting card. They demonstrate a company’s brand values and make them visible. Also, they present an opportunity for products to stand out from the competition. Consequently, the demands made of the individual design of electronics enclosures are increasing all the time,” says Sebastian Hein. The tasks of this graduate product designer and trained production model maker include both the development of design concepts for individual enclosure solutions and also the designing of BOPLA’s attractive future products. This ensures that Sebastian Hein, who also brings with him his experience as a CAD designer in the automotive sector, is a valued member of the BOPLA team which uses interdisciplinary cooperation to develop intelligent products. As early as during the first phase of product development, his rapid and individual draft designs form the basis for discussions with customers.

“Enclosures are a product’s visiting card. They demonstrate a company’s brand values and make them visible. Also, they present an opportunity for products to stand out from the competition. Consequently, the demands made of the individual design of electronics enclosures are increasing all the time,” says Sebastian Hein. The tasks of this graduate product designer and trained production model maker include both the development of design concepts for individual enclosure solutions and also the designing of BOPLA’s attractive future products. This ensures that Sebastian Hein, who also brings with him his experience as a CAD designer in the automotive sector, is a valued member of the BOPLA team which uses interdisciplinary cooperation to develop intelligent products. As early as during the first phase of product development, his rapid and individual draft designs form the basis for discussions with customers.

Individual enclosure solutions for which BOPLA deals with every stage of processing, from the initial idea to series production, are becoming increasingly popular. In creating intelligent products and tailor-made product solutions, the enclosure technology specialists combine their interdisciplinary expertise in the design, construction, HMI and electronics sectors to create an all-round carefree package for their customers. Industrial designer Sebastian Hein has recently started to provide his knowhow to the development team. “Enclosures are a product’s visiting card. They demonstrate a company’s brand values and make them visible. Also, they present an opportunity for products to stand out from the competition. Consequently, the demands made of the individual design of electronics enclosures are increasing all the time,” says Sebastian Hein. The tasks of this graduate product designer and trained production model maker include both the development of design concepts for individual enclosure solutions and also the designing of BOPLA’s attractive future products. This ensures that Sebastian Hein, who also brings with him his experience as a CAD designer in the automotive sector, is a valued member of the BOPLA team which uses interdisciplinary cooperation to develop intelligent products. As early as during the first phase of product development, his rapid and individual draft designs form the basis for discussions with customers.

Individual enclosure solutions for which BOPLA deals with every stage of processing, from the initial idea to series production, are becoming increasingly popular. In creating intelligent products and tailor-made product solutions, the enclosure technology specialists combine their interdisciplinary expertise in the design, construction, HMI and electronics sectors to create an all-round carefree package for their customers. Industrial designer Sebastian Hein has recently started to provide his knowhow to the development team. “Enclosures are a product’s visiting card. They demonstrate a company’s brand values and make them visible. Also, they present an opportunity for products to stand out from the competition. Consequently, the demands made of the individual design of electronics enclosures are increasing all the time,” says Sebastian Hein. The tasks of this graduate product designer and trained production model maker include both the development of design concepts for individual enclosure solutions and also the designing of BOPLA’s attractive future products. This ensures that Sebastian Hein, who also brings with him his experience as a CAD designer in the automotive sector, is a valued member of the BOPLA team which uses interdisciplinary cooperation to develop intelligent products. As early as during the first phase of product development, his rapid and individual draft designs form the basis for discussions with customers.

Only the dimensions are standardised: At the same time as the launch of the product catalogue, Bopla Gehäuse Systeme GmbH are restructuring their range of 19” products. Now the customer-specific assembly systems are divided into subrack and desktop enclosures, small control enclosures for the fitting of 19” subracks and front panels. In addition, BOPLA manufactures non-standard enclosures for PCBs. The ideal solution when developers require a package of services from planning to sampling to series manufacture to packaging – and all available from a single source. This ensures that BOPLA is meeting increased demands and expectations from the market. A specially-printed front panel. A desktop enclosure which can also be integrated in a cabinet. A 19” enclosure for a special size of PCB which doesn’t conform to the Euro card format. And, not least, customer-specific packaging. The demands made of 19” subracks and other assembly systems are increasing. It’s not just the sturdy outer case which is important – increasingly, customer-specific equipment details are an integral part of development. Olaf Kleineberg, BOPLA’s product manager for 19” subracks, understands that a competent partner for subracks is more important than ever: “Using the standardised 19” system as a basis, we manufacture the individual systems that our customers ask for. In addition to the wide range of products, our huge depth of production allows us to produce a unique total package from a single source.” Always in accordance with DIN EN 60297-3-101 Developers can choose between BOPLA’s metal and plastic applications for the 19”-compliant enclosures used for their electronics systems. All the components are standardised in accordance with DIN EN 60297-3-101. The different designs and sizes and a wide range of accessories provide a high degree of flexibility for different applications. In doing this, the range of products makes both standard and EMC versions available.

Only the dimensions are standardised: At the same time as the launch of the product catalogue, Bopla Gehäuse Systeme GmbH are restructuring their range of 19” products. Now the customer-specific assembly systems are divided into subrack and desktop enclosures, small control enclosures for the fitting of 19” subracks and front panels. In addition, BOPLA manufactures non-standard enclosures for PCBs. The ideal solution when developers require a package of services from planning to sampling to series manufacture to packaging – and all available from a single source. This ensures that BOPLA is meeting increased demands and expectations from the market. A specially-printed front panel. A desktop enclosure which can also be integrated in a cabinet. A 19” enclosure for a special size of PCB which doesn’t conform to the Euro card format. And, not least, customer-specific packaging. The demands made of 19” subracks and other assembly systems are increasing. It’s not just the sturdy outer case which is important – increasingly, customer-specific equipment details are an integral part of development. Olaf Kleineberg, BOPLA’s product manager for 19” subracks, understands that a competent partner for subracks is more important than ever: “Using the standardised 19” system as a basis, we manufacture the individual systems that our customers ask for. In addition to the wide range of products, our huge depth of production allows us to produce a unique total package from a single source.” Always in accordance with DIN EN 60297-3-101 Developers can choose between BOPLA’s metal and plastic applications for the 19”-compliant enclosures used for their electronics systems. All the components are standardised in accordance with DIN EN 60297-3-101. The different designs and sizes and a wide range of accessories provide a high degree of flexibility for different applications. In doing this, the range of products makes both standard and EMC versions available.

Only the dimensions are standardised: At the same time as the launch of the product catalogue, Bopla Gehäuse Systeme GmbH are restructuring their range of 19” products. Now the customer-specific assembly systems are divided into subrack and desktop enclosures, small control enclosures for the fitting of 19” subracks and front panels. In addition, BOPLA manufactures non-standard enclosures for PCBs. The ideal solution when developers require a package of services from planning to sampling to series manufacture to packaging – and all available from a single source. This ensures that BOPLA is meeting increased demands and expectations from the market. A specially-printed front panel. A desktop enclosure which can also be integrated in a cabinet. A 19” enclosure for a special size of PCB which doesn’t conform to the Euro card format. And, not least, customer-specific packaging. The demands made of 19” subracks and other assembly systems are increasing. It’s not just the sturdy outer case which is important – increasingly, customer-specific equipment details are an integral part of development. Olaf Kleineberg, BOPLA’s product manager for 19” subracks, understands that a competent partner for subracks is more important than ever: “Using the standardised 19” system as a basis, we manufacture the individual systems that our customers ask for. In addition to the wide range of products, our huge depth of production allows us to produce a unique total package from a single source.” Always in accordance with DIN EN 60297-3-101 Developers can choose between BOPLA’s metal and plastic applications for the 19”-compliant enclosures used for their electronics systems. All the components are standardised in accordance with DIN EN 60297-3-101. The different designs and sizes and a wide range of accessories provide a high degree of flexibility for different applications. In doing this, the range of products makes both standard and EMC versions available.

Only the dimensions are standardised: At the same time as the launch of the product catalogue, Bopla Gehäuse Systeme GmbH are restructuring their range of 19” products. Now the customer-specific assembly systems are divided into subrack and desktop enclosures, small control enclosures for the fitting of 19” subracks and front panels. In addition, BOPLA manufactures non-standard enclosures for PCBs. The ideal solution when developers require a package of services from planning to sampling to series manufacture to packaging – and all available from a single source. This ensures that BOPLA is meeting increased demands and expectations from the market. A specially-printed front panel. A desktop enclosure which can also be integrated in a cabinet. A 19” enclosure for a special size of PCB which doesn’t conform to the Euro card format. And, not least, customer-specific packaging. The demands made of 19” subracks and other assembly systems are increasing. It’s not just the sturdy outer case which is important – increasingly, customer-specific equipment details are an integral part of development. Olaf Kleineberg, BOPLA’s product manager for 19” subracks, understands that a competent partner for subracks is more important than ever: “Using the standardised 19” system as a basis, we manufacture the individual systems that our customers ask for. In addition to the wide range of products, our huge depth of production allows us to produce a unique total package from a single source.” Always in accordance with DIN EN 60297-3-101 Developers can choose between BOPLA’s metal and plastic applications for the 19”-compliant enclosures used for their electronics systems. All the components are standardised in accordance with DIN EN 60297-3-101. The different designs and sizes and a wide range of accessories provide a high degree of flexibility for different applications. In doing this, the range of products makes both standard and EMC versions available.

Our BOS Entry Line photoelectric sensors impress with their precise performance, compact design, and easy integration into your systems. With a wide range of variants, all optical sensors in this series offer reliable quality and strong performance – all at an attractive price-performance ratio. BOS Entry Line - Your advantages: - Unbeatable price – with the features you need and the Balluff quality promise - Quick and easy installation – with standard hole spacing and internal threads - Robust IP67 housing with 360° visible LEDs – for clear status indication at a glance - Environmentally friendly packaging – available as a single or multipack. Ready to hand and ready for use.

A variety of devices from leading manufacturers in the IO-Link community create a diverse and practical race track. Every visitor is invited to try and beat the current lap record and witness live how the most important race data is captured via IO-Link and simultaneously visualized on a screen. The race track impressively demonstrates what has already proven successful in large industrial plants: the interoperability of IO-Link masters with a wide range of devices and their straightforward integration into control systems. On a small scale, it shows how IO-Link solutions work in practice and what possibilities they offer for automation. IO-Link is a globally standardized communication interface for sensors and actuators. It enables seamless, bidirectional data transmission down to the field level and significantly simplifies parameterization, diagnostics, and device replacement – ​​regardless of the manufacturer. The IO-Link community looks forward to welcoming you at All About Automation, booth B6-753 at the Hamburg Messe. Whether you're looking for exciting races, inspiring discussions, or innovative solutions – a visit is definitely worthwhile!

KannMOTION sets standards for pump drives. With a KannMOTION drive, precise dosing in continuous operation becomes easy. The compact design of the KannMOTION drives fits even in tight spaces, and the daisy-chain principle makes wiring quick and easy. From the laboratory to industry - For peristaltic, diaphragm, or piston pumps, KannMOTION drives save space and installation effort, offering a robust, cost-effective solution. The advantages at a glance: • 24/7 continuous operation with precise dosing accuracy • Compact design for tight installation spaces • Easy cabling thanks to the daisy-chain principle • Cost-effective, robust, and durable Key features: • Panel-mount drive for pump heads • Speed ​​range 0.1–600 rpm, adjustable in 0.1 rpm increments • Closed-loop control for consistent, cool, and quiet performance • Cool-running feature for thermal stability • CANopen or ADC version with 0–10 V speed control • PC software via USB: evaluate, optimize, and diagnose • Integrated PLC for decentralized control functions • Compatible with various peristaltic pump manufacturers • Watson-Marlow compatible with Series 100 and Series 400 👉 Whether in the laboratory, medical technology, or industry – our pump drives from KannMOTION offer maximum precision, efficiency, and flexibility.