Exhibitor news

Both the design and functionality of Bocube Alu enclosures set new standards. The diecast aluminium enclosures are much more than just an attractive casing for modern industrial electronics, because they also offer protection even under extremely harsh ambient conditions. The standard recessed cover area of the new large Bocube Alu allows the fitting of larger display and keypad formats. Especially in this sector, the Bocube Alu enclosures’ standard integrated hinge technology makes handling much easier. In addition, an optional silicone lid seal allows use even under extreme temperature conditions. Good to know In contrast to comparable products, it is not necessary to remove the screw covers when opening the Bocube Alu enclosure. ll the components – lid, screws, covers, etc. – remain on the enclosure. This prevents any dangers for operators and machines caused by falling or lost enclosure parts. Consequently, all Bopla Alu enclosures comply with important requirements of the EU machinery directive. To ensure the cost-effective integration of pressure compensation elements, the bases of all Bocube Alu enclosures feature a moulded-on insertion opening for a pressure compensation membrane. In addition to the standard colours of light grey and graphite grey, special colours can be provided on request.

With regard to design and functionality, the enclosures in the Bocube Alu series create new standards in the aluminium diecast enclosure sector. They provide modern industrial electronic items with a perfect setting and protect them even under harsh environmental conditions. The new Bocube Alu S models without hinges are especially suitable for narrow installation situations in which there is not enough space to swivel the cover upwards. They are also ideal for situations in which the enclosure is subjected to extremely high vibration loads. The four cover screws ensure that the enclosure screws always keep the cover securely tight. Of course, Bocube Alu S also complies with the usual protection classes of IP66 / 68 (1.2m; 2h) / 69 found in the standard series. An optional silicone cover seal is suitable for use even under extreme temperature conditions. In addition to the variants in the standard light grey and graphite grey colours, special colours can also be provided on request. Just as with all Bocube Alu enclosures, the new models with a screw-on cover are prepared for the cost-effective integration of a pressure compensation element (DAE), and they offer space for rectangular panels and PCBs.

Electronic enclosures are not only used in protected indoor rooms. They are often exposed to wind and weather, for example when used in agriculture, traffic or the field of renewable energies. This is where the polycarbonate UL 94 V0 Bocube enclosures can demonstrate their abilities. The wind, weather, changing temperatures and above all ultraviolet radiation cannot affect this material, which also has excellent mechanical characteristics. All this ensures that the electronics inside are protected against the effects of weather. Mathias Bünte, BOPLA’s product manager, explains: “The material’s weather resistance was confirmed on the basis of normative test procedures which were carried out on the UL 746C. This allows us to provide our customers with an exact definition of the parameters and restrictions in respect of outdoor use.” Innovative system Bocube enclosures made of the flame-retardant or self-extinguishing materials ABS and polycarbonate UL 94 V0 impress users with their uncomplicated assembly and a unique range of features and components. 19 enclosure sizes and two lid and colour variants make it possible to create 114 different standard enclosures for electronic components. Patented hinged catches in many different colours – including crystal clear and translucent green – permit visual matching to the customer’s corporate design and also the development of interesting lighting effects by the use of LEDs mounted underneath the hinged catches. The lids have an area which is recessed by 2 mm for the fitting of input devices such as membrane keypads (exception: B 080805, 0.5 mm). They can be opened to the left or right, as required, which makes it easy to assemble and access the electronics. The enclosures provide space for scored PCBs and rectangular mounting panels which can be installed in both the lid and the base. Rectangular front panels can be fitted in the base by means of distance bolts.

The modern designs of BOPLA’s compact enclosures in the BoPad range for the integration of membrane keypads, touch screens and displays not only look good as mobile hand-held devices. As a console variant with an angled operating surface and installation options for market-standard 4.3” to 10.1” touch displays, they really catch the eye as a highly-functional operating terminal on a table or wall. Inspired by customers’ requests, the specialists for enclosure systems have added new enclosure variants to their BoPad range. These include higher console enclosures and also enclosures with a square base area. Also new: integrated holders for the direct mounting of current Raspberry Pi single board computers and a small VESA wall fitting which can be used with all devices in the enclosure ranges. The new BOP 7.0 PQ and BOP 10 BoPad console variants are based on the existing BOP 7.0 and BOP 10.1 BoPad enclosures, but their higher shape provides more space for the installation of electronic components. The new design has a greater angle for the operating surface, and this ensures more operating comfort. In addition, side-mounted recessed grips make it even easier to handle the BoPad enclosures. The rear panel is positioned further back, which increases the mechanical protection of the interfaces. As with all the hand-held and console enclosures in the BoPad range, the new models also have a recessed area in the lid for the integration of membrane keypads and touch screens. A polished frame creates a high-quality appearance and protects the operating surface. All BoPad enclosures provide protection class IP40 as standard. However, this can be increased to a maximum of IP65 at any time by the use of optional seals in four colours (black, white, signal red and signal blue), and also subsequently if required.

Bopla Gehäuse Systeme GmbH continues to grow. The company has now opened another location in Kirchlengern, Germany. On an area of around 2,000 square meters, the enclosure technology specialist is creating new production capacities in the immediate vicinity of its headquarters in Bünde, East Westphalia. The aim is to continue the company's development into an integrated systems supplier. While the area for customer-specific enclosures and other production units are relocating to Kirchlengern, new space is also being created in Bünde for expansion in the area of system integration. Our new location in Kirchlengern is the key to positioning ourselves as a holistic system provider," says Managing Director Ralf Bokämper. "We are creating opportunities to offer customers enclosure systems from a single source in an enormous vertical range of manufacture and to intensify system integration services. Optimized material flow for even better performance In Kirchlengern, the company is moving into three contiguous hall complexes in the West Industrial Estate not far from its headquarters. There, we will concentrate on all activities in the field of Custom Designed Enclosures (CDE), which include 19-inch enclosures. The center of the new location is the production with assembly. The material flow has been optimized so that we can offer even faster delivery times in the future. By bundling the CDE division, all competencies - including design, project and production control, purchasing and sales - can be found at one location. In addition to production, we are also installing a new warehouse, quality assurance, aluminum profile processing and new bending technology for sample production.

Optimized material flow for even better performance In Kirchlengern, the company is moving into three contiguous hall complexes in the West Industrial Estate not far from its headquarters. There, we will concentrate on all activities in the field of Custom Designed Enclosures (CDE), which include 19-inch enclosures. The center of the new location is the production with assembly. The material flow has been optimized so that we can offer even faster delivery times in the future. By bundling the CDE division, all competencies - including design, project and production control, purchasing and sales - can be found at one location. In addition to production, we are also installing a new warehouse, quality assurance, aluminum profile processing and new bending technology for sample production. Optimized material flow for even better performance In Kirchlengern, the company is moving into three contiguous hall complexes in the West Industrial Estate not far from its headquarters. There, we will concentrate on all activities in the field of Custom Designed Enclosures (CDE), which include 19-inch enclosures. The center of the new location is the production with assembly. The material flow has been optimized so that we can offer even faster delivery times in the future. By bundling the CDE division, all competencies - including design, project and production control, purchasing and sales - can be found at one location. In addition to production, we are also installing a new warehouse, quality assurance, aluminum profile processing and new bending technology for sample production.

Bopla Gehäuse Systeme GmbH continues to grow. The company has now opened another location in Kirchlengern, Germany. On an area of around 2,000 square meters, the enclosure technology specialist is creating new production capacities in the immediate vicinity of its headquarters in Bünde, East Westphalia. The aim is to continue the company's development into an integrated systems supplier. While the area for customer-specific enclosures and other production units are relocating to Kirchlengern, new space is also being created in Bünde for expansion in the area of system integration. Optimized material flow for even better performance In Kirchlengern, the company is moving into three contiguous hall complexes in the West Industrial Estate not far from its headquarters. There, we will concentrate on all activities in the field of Custom Designed Enclosures (CDE), which include 19-inch enclosures. The center of the new location is the production with assembly. The material flow has been optimized so that we can offer even faster delivery times in the future. By bundling the CDE division, all competencies - including design, project and production control, purchasing and sales - can be found at one location. In addition to production, we are also installing a new warehouse, quality assurance, aluminum profile processing and new bending technology for sample production.

Bopla Gehäuse Systeme GmbH continues to grow. The company has now opened another location in Kirchlengern, Germany. On an area of around 2,000 square meters, the enclosure technology specialist is creating new production capacities in the immediate vicinity of its headquarters in Bünde, East Westphalia. The aim is to continue the company's development into an integrated systems supplier. While the area for customer-specific enclosures and other production units are relocating to Kirchlengern, new space is also being created in Bünde for expansion in the area of system integration. Optimized material flow for even better performance In Kirchlengern, the company is moving into three contiguous hall complexes in the West Industrial Estate not far from its headquarters. There, we will concentrate on all activities in the field of Custom Designed Enclosures (CDE), which include 19-inch enclosures. The center of the new location is the production with assembly. The material flow has been optimized so that we can offer even faster delivery times in the future. By bundling the CDE division, all competencies - including design, project and production control, purchasing and sales - can be found at one location. In addition to production, we are also installing a new warehouse, quality assurance, aluminum profile processing and new bending technology for sample production.

As part of its strategic development, the long-standing expertise of the Kundisch brand, which belongs to BOPLA, has been structurally realigned. BOPLA is expanding its portfolio with the newly created ‘Innovation’ division, which consists of former Kundisch employees. This will bring together expertise, development strength and production under one roof in future. ‘With the new Innovation division, we are laying the foundation for supporting customers even earlier in the development process and jointly advancing new technologies,’ explains Sebastian Gepp, Head of Innovation. ‘Printed and hybrid electronics are key technologies of the future – and we at BOPLA are ready to actively shape this path.’ The Innovation division focuses on forward-looking applications such as: - Transparent antennas - Transparent film heaters - Hybrid electronics solutions In the field of hybrid electronics solutions, BOPLA combines different technologies to create powerful, integrated systems. These include subtractive etching processes, additive printing technologies and the assembly of flexible, printed films. This combination results in a wide range of functional, highly customisable solutions for demanding applications. The combination of BOPLA's many years of expertise in enclosures with Kundisch's expertise in membrane keyboards and printed functional technologies results in comprehensive solutions – from the initial idea to prototyping and series production. ‘Our customers benefit from the fact that we not only supply individual components, but complete, future-proof system solutions,’ adds Sebastian Gepp. ‘The new innovation division is an important building block in positioning BOPLA as a technology leader in the long term.’ With this step, BOPLA is underlining its strategic orientation: innovation, networking of technologies and sustainable further development of its product worlds.

Radar sensors impress with their precision, speed, and reliability, even under harsh environmental conditions. They deliver stable measurement results regardless of light, dirt, humidity, or temperature fluctuations and are ideal for demanding industrial applications. With their long range, precise resolution, and fast response times, they master tasks that other technologies often cannot. The Balluff BRS radar sensor in the M30 housing represents the new pinnacle of sensors with 122 GHz technology. As the worlds first radar sensor, it combines the advantages of radar technology for near-field object detection and precise distance measurement. This makes it the ideal solution for applications requiring precision, speed, and robustness. Thanks to its M30 housing with IP69K protection class and IO-Link and analog interfaces, the M30 radar sensor is optimally equipped for industrial use.

By using BOPLA’s capacitive keypads, sensors and electronic evaluation systems can be integrated in a compact membrane keypad/HMI instead of being separate from the user interface on the PCB, as is usually the case. This is made possible by hybrid electronics, with which freely-formed surfaces can be flexibly equipped with individually-designed touch sensors. These sensors can be printed as a single key, slider or matrix directly onto the relevant operating surface – glass, acrylic glass, enclosure lid – or onto a separate membrane. This type of touch sensor membrane can be glued onto any surface, in this way converting it into an HMI. Individual design, high level of long-term stability and low material costs In addition to maximum flexibility in the choice of surfaces and the application-specific design of the capacitive HMI systems, the advantages of printed electronics include efficient manufacturing and reduced material consumption. Combining these with graphic printing saves additional costs. At the same time, the reliability and durability of the HMI systems increase, because the perfect function of the closed surface is also guaranteed in conditions of moisture, aggressive liquids, dirt and other impurities. BOPLA’s capacitive membrane keypads/HMIs are also easy to clean, so they can be used equally in especially harsh industrial environments, public spaces or hygienically clean situations such as medical or foodstuffs production. In order to guarantee secure signal evaluation, BOPLA supplies capacitive HMI systems as a “plug and play” solution together with customer-specific flat connectors for connecting the sensor electronics to the existing system.

By using BOPLA’s capacitive keypads, sensors and electronic evaluation systems can be integrated in a compact membrane keypad/HMI instead of being separate from the user interface on the PCB, as is usually the case. This is made possible by hybrid electronics, with which freely-formed surfaces can be flexibly equipped with individually-designed touch sensors. These sensors can be printed as a single key, slider or matrix directly onto the relevant operating surface – glass, acrylic glass, enclosure lid – or onto a separate membrane. This type of touch sensor membrane can be glued onto any surface, in this way converting it into an HMI. Individual design, high level of long-term stability and low material costs In addition to maximum flexibility in the choice of surfaces and the application-specific design of the capacitive HMI systems, the advantages of printed electronics include efficient manufacturing and reduced material consumption. Combining these with graphic printing saves additional costs. At the same time, the reliability and durability of the HMI systems increase, because the perfect function of the closed surface is also guaranteed in conditions of moisture, aggressive liquids, dirt and other impurities. BOPLA’s capacitive membrane keypads/HMIs are also easy to clean, so they can be used equally in especially harsh industrial environments, public spaces or hygienically clean situations such as medical or foodstuffs production. In order to guarantee secure signal evaluation, BOPLA supplies capacitive HMI systems as a “plug and play” solution together with customer-specific flat connectors for connecting the sensor electronics to the existing system.

By using BOPLA’s capacitive keypads, sensors and electronic evaluation systems can be integrated in a compact membrane keypad/HMI instead of being separate from the user interface on the PCB, as is usually the case. This is made possible by hybrid electronics, with which freely-formed surfaces can be flexibly equipped with individually-designed touch sensors. These sensors can be printed as a single key, slider or matrix directly onto the relevant operating surface – glass, acrylic glass, enclosure lid – or onto a separate membrane. This type of touch sensor membrane can be glued onto any surface, in this way converting it into an HMI. Individual design, high level of long-term stability and low material costs In addition to maximum flexibility in the choice of surfaces and the application-specific design of the capacitive HMI systems, the advantages of printed electronics include efficient manufacturing and reduced material consumption. Combining these with graphic printing saves additional costs. At the same time, the reliability and durability of the HMI systems increase, because the perfect function of the closed surface is also guaranteed in conditions of moisture, aggressive liquids, dirt and other impurities. BOPLA’s capacitive membrane keypads/HMIs are also easy to clean, so they can be used equally in especially harsh industrial environments, public spaces or hygienically clean situations such as medical or foodstuffs production. In order to guarantee secure signal evaluation, BOPLA supplies capacitive HMI systems as a “plug and play” solution together with customer-specific flat connectors for connecting the sensor electronics to the existing system.

Efficient packaging – fully automated: The CIRRUS EasyTear automatically and safely tears air cushion chains to custom lengths – completely blade-free. This ensures maximum efficiency and flexibility in the packaging process while saving valuable time. With its high throughput, sensor-controlled automatic mode, and optional foot pedal, the system integrates seamlessly into various workflows – ergonomic, safe, and thoughtfully designed. Whether short chains or long runs, both length and quantity can be flexibly adjusted – no sharp blades or additional tools required.